摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board, a piezoelectric oscillator, a gyro sensor, and a method for manufacturing the wiring board. <P>SOLUTION: There are included a base substrate 12 having a first plane (surface 12a) and a second plane (reverse side 12b), a first insulation layer 14 laminated on the first plane, a pad electrode 16 laminated on the first insulation layer 14, a through electrode 20 connected to the pad electrode 16, and a second insulation layer 24 provided between the base substrate 12 and the first insulation layer 14. The diameter of the through electrode 20 at a connecting section (bottom section 22a) where it connects to the pad electrode 16 is smaller than that of the through electrode 20 on the second plane. In a peripheral region of a connecting section (bottom section 22a) where the through electrode 20 and the pad electrode 16 connect, the first insulation layer 14 and the second insulation layer 24 and the through electrode 20 overlap in a plan view, and the thickness of the first insulation layer 14a in the peripheral region is thinner than that of the first insulation layer 14 in other regions. <P>COPYRIGHT: (C)2012,JPO&INPIT |