CHEMICAL MECHANICAL POLISHING SLURRY COMPOSITIONS AND POLISHING METHOD USING THE SAME
摘要
Disclosed herein is a CMP slurry composition. The CMP slurry composition includes cerium oxide particles, an adsorbent for adsorbing the cerium oxide particles to a polishing pad, an adsorption adjusting agent for adjusting adsorption performance of the adsorbent, and a pH adjusting agent. The CMP slurry composition may improve polishing efficiency of a patterned oxide layer and lifespan of a diamond disc conditioner.
申请公布号
WO2011081503(A2)
申请公布日期
2011.07.07
申请号
WO2010KR09637
申请日期
2010.12.31
申请人
CHEIL INDUSTRIES INC.;KIM, TAI YOUNG;CHOI, BYOUNG HO;HONG, CHANG KI;KIM, HYUNG SOO
发明人
KIM, TAI YOUNG;CHOI, BYOUNG HO;HONG, CHANG KI;KIM, HYUNG SOO