| 摘要 |
The invention relates to a micromechanical method and a corresponding assembly for bonding semiconductor substrates and a correspondingly bonded semiconductor chip. The assembly according to the invention comprises a semiconductor substrate having a chip pattern having a plurality of semiconductor chips (1), each having a functional region (4) and an edge region (4a) surrounding the functional region (4), wherein there is a bonding frame (2) made of a bonding alloy made from at least two alloy components in the edge region (4a), spaced apart from the functional region (4). Within the part (4a2) of the edge region (4a) surrounding the bonding frame (2) between the bonding frame (2) and the functional region (4), there is at least one stop frame (7; 7a, 7b; 7b'; 70) made of at least one of the alloy components, which is designed such that when a melt of the bond alloy contacts the stop frame (7; 7a, 7b; 7b'; 70) during bonding, the bonding alloy solidifies. |
