发明名称 |
Decoupling capacitor closely coupled with integrated circuit |
摘要 |
An integrated circuit module, decoupling capacitor assembly and method are disclosed. The integrated circuit module includes a substrate and integrated circuit die mounted on the substrate and having die pads and an exposed surface opposite from the substrate. A plurality of substrate bonding pads are positioned on the substrate adjacent the integrated circuit die. A decoupling capacitor assembly is mounted on each integrated circuit die and includes a capacitor carrier secured onto the exposed surface of the integrated circuit die and a decoupling capacitor carried by the capacitor carrier. A wire bond extends from the decoupling capacitor assembly to a die pad and from a die pad to a substrate bonding pad.
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申请公布号 |
US7642131(B2) |
申请公布日期 |
2010.01.05 |
申请号 |
US20060557564 |
申请日期 |
2006.11.08 |
申请人 |
HARRIS CORPORATION |
发明人 |
VINSON ROBERT S.;BRIEF JOSEPH B.;BECK DONALD J.;JANDZIO GREGORY M. |
分类号 |
H01L21/00;H01L23/64;H01L25/065 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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