发明名称 THREE-DIMENSIONAL STACKED NONVOLATILE SEMICONDUCTOR MEMORY
摘要 <P>PROBLEM TO BE SOLVED: To provide a three-dimensional stacked nonvolatile semiconductor memory for improving program disturbance of a BiCS memory. <P>SOLUTION: A three-dimensional stacked nonvolatile semiconductor memory comprises a memory cell array comprised of first and second blocks BK<i>, BK<i+1>. The first block has a first cell unit including a memory cell to be programmed, and a second cell unit not including the memory cell to be programmed, and executes programming by applying a program potential Vpgm or a transfer potential Vpass to word lines WL<0>, WL<1>, WL<2>, WL<3> in the first block after the initial potential of channels in the memory cell in the first and second cell units is set to a plus potential. In programming, the program potential Vpgm and transfer potential Vpass are not applied to the word lines WL<0>, WL<1>, WL<2>, WL<3> in the second block. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009266946(A) 申请公布日期 2009.11.12
申请号 JP20080112659 申请日期 2008.04.23
申请人 TOSHIBA CORP 发明人 MAEJIMA HIROSHI
分类号 H01L21/8247;G11C16/02;G11C16/04;H01L27/10;H01L27/115;H01L29/788;H01L29/792 主分类号 H01L21/8247
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