| 摘要 |
PURPOSE: Slurry for chemical mechanical polishing is provided to effectively remove scratch and a damaged surface layer and to improve polishing rate through organic combination of an abrasive, an oxidizer and etchant. CONSTITUTION: Slurry for chemical mechanical polishing includes an abrasive, an oxidizer, and an etchant. The abrasive has more than hardness of the colloidal silica and less than hardness of a diamond. The abrasive is any one of alumina(Al2O3), zirconia(ZrO2), SiC, B4C, cBN, and diamond. The oxidizer has pH 14 or less and the electrochemical potential of the oxidizer is not smaller than 1.
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