| 摘要 |
<p>A manufacturing method of a semiconductor package is provided to manufacture a semiconductor package with a simple process and a low cost by bumping a bump ball through an existing wire bonder device. A first pre-substrate(10a) having the same size as a substrate of a strip unit is included by using a molding compound resin. A plurality of semiconductor chips(20) is attached on a surface of the first pre-substrate. A bump ball(30) is formed on a bonding pad of each semiconductor chip attached on the first pre-substrate through a wire bonder device. The first pre-substrate is attached on a substrate of the strip unit. The bump ball formed on the bonding pad of each semiconductor chip is attached on a conductive pattern for contacting the substrate. The semiconductor chip is connected to the substrate.</p> |
