发明名称 RETAINER RING FOR CMP (CHEMICAL MECHANICAL POLISHING) APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a retainer ring which can minimize the time required for break-in polishing. <P>SOLUTION: A corner part on the inner peripheral side on the side of a pressing surface 8a and a corner part on the outer peripheral side are formed in an R-shape and the pressing surface 8a is graded from the inner peripheral side to the outer peripheral side. Thus, the shape on the side of the pressing surface 8a of the retainer ring 8 becomes a state similar to the shape of the pressing surface side of the retainer ring with which an appropriate polishing result is obtained, and the shape of the side of the pressing surface 8a becomes appropriate from the beginning. As a result, immediately after mounting the retainer ring 8 or just by performing break-in polishing for a short period of time, the appropriate polishing result is obtained. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009033086(A) 申请公布日期 2009.02.12
申请号 JP20070313316 申请日期 2007.12.04
申请人 NIPPON SEIMITSU DENSHI CO LTD 发明人 ICHINOSHIME TSUTOMU
分类号 H01L21/304;B24B37/32 主分类号 H01L21/304
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