METAL ELECTRONIC PACKAGE

摘要

A process for assembling a package containing an enclosure to house an electronic device, includes the steps of providing an electrically conductive leadframe. The leadframe has first and second surfaces and is comprised of a plurality of lead fingers disposed about a centrally positioned die attach pad. The electronic device is bonded to the die attach pad and is electrically connected to the leads. The process also includes the steps of providing a first, second and third bonding means, providing a base component and providing a cover component. The base component is bonded to the first surface of the leadframe with the first bonding means and at essentially the same time the base component is bonded to the die attach pad with the third bonding means. The cover component is bonded to the second surface of the leadframe with the second bonding means.