| 摘要 |
A power semiconductor module having a contact spring is provided to supply a power semiconductor module having a fixed connection part of an elastic shape by including a substrate having a housing and at least one metal conduction track. At least one connection part is composed of a contact spring(70) including a first contact part, an elastic part and a second contact part. A housing(3) has a section part(30) including first and second partial section parts(32,34) for disposing the contact spring. The first contact part of the contact spring is made of a pin shape. The diameter of the second partial section part is not more than the sum of the diameter of the first contact part and the transformation quantity determined by transformation parts of the first contact part. The transformation parts are disposed between the second partial section part and a substrate. |
