发明名称 |
Semiconductor device having landing pad and fabrication method thereof |
摘要 |
A semiconductor device can be provided comprising a semiconductor substrate having an upper surface. A plurality of adjacent line patterns are formed on the upper surface of the semiconductor substrate. Each line pattern includes a line having a capping layer pattern stacked thereon. A material layer covers the upper surface of the semiconductor substrate having the line patterns. A pad contact hole is located between the line patterns within a region of the material layer. The pad contact hole includes a lower opening between the line patterns and an upper opening located above the lower opening. A barrier layer is formed on a side wall defining the upper opening. A landing pad substantially fills the lower opening and the upper opening defined by the barrier layer.
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申请公布号 |
US7385242(B2) |
申请公布日期 |
2008.06.10 |
申请号 |
US20050155144 |
申请日期 |
2005.06.16 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE YUN-SUNG;PARK JOO-SUNG |
分类号 |
H01L21/8234;H01L23/522;H01L21/60;H01L21/768;H01L21/8242;H01L27/108 |
主分类号 |
H01L21/8234 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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