发明名称 CERAMIC SUBSTRATE, PACKAGE FOR HOUSING ELECTRONIC COMPONENT, ELECTRONIC APPARATUS, AND MANUFACTURING METHOD FOR THEM
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of a ceramic green sheet lamination, capable of favorably forming a gap having a predetermined shape for properly dividing it along a dividing groove. SOLUTION: The ceramic green sheet laminate 5 is formed by laminating a ceramic green sheets 1 and 3 to be outer layers and a ceramic green sheet 2 to be an inner layer, and by forming the dividing groove 7 along the outer edge of a wiring board region. In the manufacturing method of the ceramic green sheet laminate 5, a first step of laminating the ceramic green sheets 1 and 3 on the ceramic green sheet 2, comprising a vertically penetrating through groove 4 so that a region where the region having the dividing groove 7 formed therein and the through groove 4 that is superimposed extends along the outer edge of the wiring board region, and a second step of pressing the laminated ceramic green sheets are carried out. Thus, deformation of the ceramic green sheet 2 in the periphery of the first through groove can be made small, and closing of the gap, consisting of the through groove, can be suppressed easily. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007294797(A) 申请公布日期 2007.11.08
申请号 JP20060123145 申请日期 2006.04.27
申请人 KYOCERA CORP 发明人 IINO KUNIO
分类号 H01L23/12;H05K1/02;H05K3/00;H05K3/46 主分类号 H01L23/12
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