PLASMA PROCESSING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a plasma processing apparatus capable of reducing deposits depositing on a workpiece.

SOLUTION: The plasma processing apparatus comprises an etching apparatus for etching the workpiece 2 by supplying etching gas to a processing chamber 1; and an ashing apparatus for ashing the workpiece 2 by supplying ashing gas to the chamber 1. A diameter (b) of the placement section of the placement stage of the ashing apparatus is smaller than a diameter (a) of the placement section of the placement stage of the etching apparatus, and the diameter (a) of the placement section of the placement stage of the etching apparatus is smaller than that of the workpiece.

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