发明名称 SUBSTRATE WITH EXTENSION BOARD AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a substrate with an extension board excellent in reliability having low incidence of short circuit failure, in spite of comparatively low cost. SOLUTION: A substrate 61 with an extension board is provided with a substrate 41 made of resin, and an extension board 31. Two or more substrate side solder bumps 37 are formed on two or more surface connection pads 46 arranged in the principal surface 42 of the substrate 41 made of resin. The extension board 31 has an extension board main part 38 and two or more conductive pillars 35. An extension board side solder bump 36 is arranged only at a first surface side edge of two or more conductive pillars 35. The principal surface 42 side of the substrate 41 made of resin and the second surface 33 side of the extension board main part 38 are pasted up via a solder resist 53. The two or more conductive pillars 35 and the two or more surface connection pads 46 are electrically connected via the two or more substrate side solder bumps 37. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007027337(A) 申请公布日期 2007.02.01
申请号 JP20050206255 申请日期 2005.07.14
申请人 NGK SPARK PLUG CO LTD 发明人 URASHIMA KAZUHIRO;ORIGUCHI MAKOTO
分类号 H01L23/32;H01L23/12 主分类号 H01L23/32
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