POLYIMIDE THICKFILM FLOW FEATURE PHOTORESIST AND METHOD OF APPLYING SAME

摘要

A polyimide photoresist for thick film flow features adheres to a polyimide nozzle plate or other materials, without the use of an adhesive material between the two surfaces. Further, the photoresist can utilize an acrylate UV initiator, which can reduce the potential for HF to interact with the ink, and which can cause flocculation and eliminate the need for extremely long postbake cures used to remove HF from the photoresist. In another embodiment, an epoxy adhesive containing a dicyandiamide catalyst can be used to improve adhesion between polyimide films and a respective substrate.