发明名称 |
Methods and apparatus for wire bonding with wire length adjustment in an integrated circuit |
摘要 |
An integrated circuit is wire bonded in a manner such that there is consistent RF performance from integrated circuit package to integrated circuit package. Bond distances within the integrated circuit are measured, each corresponding to a wire bond to be formed. An area under a hypothetical wire bond profile is calculated as a function of the bond distances, a baseline wire length, and a baseline loop height. A wire is bonded across a given one of the bond distances to form a given one of the wire bonds. A wire bond profile for the given wire bond is provided having an area thereunder that is substantially equal to the calculated area.
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申请公布号 |
US2005183265(A1) |
申请公布日期 |
2005.08.25 |
申请号 |
US20040787010 |
申请日期 |
2004.02.25 |
申请人 |
BAMBRIDGE TIMOTHY B.;BOWEN JOHN W.;BRENNAN JOHN M.;FREUND JOSEPH M. |
发明人 |
BAMBRIDGE TIMOTHY B.;BOWEN JOHN W.;BRENNAN JOHN M.;FREUND JOSEPH M. |
分类号 |
H01L23/49;H01L23/66;H01L27/082;H01L27/102;(IPC1-7):H01L27/082 |
主分类号 |
H01L23/49 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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