| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive excellent in heat resistance, easy in application due to its low viscosity, curing reaction of which proceeds rapidly in a short time, and after cured, exhibiting high adhesive strength especially in peeling strength. SOLUTION: This heat-resistant adhesive comprises (A) a novolak-type vinyl ester, (B) a bisphenol A-type vinyl ester having a≥800 number-average molecular weight, (C) a (meth)acrylate compound having a 6-12C molecular structure except a (meth)acryloxy part such as an alkyl (meth)acrylate, (D) an organic peroxide and (E) a curing accelerator. COPYRIGHT: (C)2005,JPO&NCIPI
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