| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a piezoelectric oscillator component mounting method which is capable of mounting a component in a flip chip mounting manner by mounting a chip component having a double-sided electrode structure. <P>SOLUTION: A VCXO 16 has such a structure wherein a first cavity 18 is provided on the inner bottom of a ceramic package 17, an IC chip 4 is mounted in the cavity 18, furthermore a second cavity 19 is provided to the bottom of the first cavity 18, and a varactor diode 6 is mounted in the second cavity 18. A bottom electrode 20 provided to the varactor diode 6 is connected and fixed to a pad electrode 21 provided on the bottom of the second cavity 19 with a conductive adhesive agent 7. On the other hand, an IC chip 4 is connected and fixed to pad electrodes 22 provided on the bottom of the first cavity 18 and to a top electrode 23 provided to the top end of the varactor diode 6 in a flip chip mounting manner. Thereafter, a quartz oscillator 13 is connected and fixed with a conductive adhesive agent 12 in a cantilever state to a pad electrode 25 formed on a stepped part 24 provided inside a ceramic package 17, and the opening of the ceramic package17 is covered with a lid 14. <P>COPYRIGHT: (C)2004,JPO |
