发明名称 |
System for the improved handling of wafers within a process tool |
摘要 |
A substrate fabrication system is provided which includes a buffer station located inline between a front docking port and a loadlock chamber, the buffer station being operatively joined with a front handling chamber. Preferred embodiments employ a buffer station having a rack with reduced pitch, or relative spacing between shelves. Additional embodiments provide variable pitch end effectors as part of the disclosed fabrication system.
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申请公布号 |
US2004062627(A1) |
申请公布日期 |
2004.04.01 |
申请号 |
US20030665693 |
申请日期 |
2003.09.17 |
申请人 |
AGGARWAL RAVINDER;KUSBEL JIM;ALEXANDER JIM |
发明人 |
AGGARWAL RAVINDER;KUSBEL JIM;ALEXANDER JIM |
分类号 |
H01L21/677;(IPC1-7):B65G1/00 |
主分类号 |
H01L21/677 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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