| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing apparatus which is capable of processing wafers of high purity, while suppressing its foot print occupied. SOLUTION: The semiconductor manufacturing apparatus comprises a processing chamber 14 that processes the wafers W, a load-lock standby chamber 4, which adjoins the process chamber 14, and a load-locking buffer chamber 33, which adjoins the upper face of the standby chamber 4, wherein a temporally placing pedestal opening 35, through which a temporally placing pedestal 43, which temporally holds a group of wafers W, moves in the vertical directions, is settled at a partition wall that separates the standby room 4 and the buffer room 33. An elevator 39 for the temporally placing pedestal that moves the temporally placing pedestal 43 in the vertical direction is so constituted that a sealing flange 42 that opens and closes the temporally placing pedestal opening 35 also moves up and down. COPYRIGHT: (C)2004,JPO |
