| 摘要 |
PURPOSE: A lithographic apparatus, device manufacturing method, and device manufactured thereby are provided to prealign polygonal substrates with accuracy and quickly without damage caused by chipping. CONSTITUTION: A radiation system configured to supply a projection beam of radiation. In this particular example, the radiation system Ex, IL, for supplying a projection beam PB of radiation(e.g. UV or EUV radiation) also comprises a radiation source LA. A support structure configured to support a patterning structure capable of patterning the projection beam. In this example, a first object table(mask table) MT is provided with a mask holder for holding a mask MA(e.g. a reticle), and is connected to a first positioning structure for accurately positioning the mask with respect to item PL. A second object table(substrate table) configured to hold a substrate. In this example, substrate table WT is provided with a substrate holder for holding a substrate W(e.g. a resist-coated silicon wafer), and is connected to a second positioning structure for accurately positioning the substrate with respect to item PL. A projection system("lens") configured to project the patterned beam. In this example, projection system PL(e.g. a lens group, a catadioptric or catoptric system, and/or a mirror system) is configured to image an irradiated portion of the mask MA onto a target portion C(e.g. comprising one or more dies) of the substrate W.
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