| 摘要 |
PROBLEM TO BE SOLVED: To keep high reliability even if density elevation and downsizing are contrived, concerning a semiconductor device which has ship size package where sealing resin is arranged on a semiconductor chip, and to provide its manufacturing method. SOLUTION: The semiconductor device is provided with a semiconductor element 22 where bump electrodes 23 are formed, and sealing resin 24 for sealing the circuit formation face 29 of the semiconductor element 22 on condition that at least the tip 23A of the bump electrodes 23 are exposed. Further more, the device has a mounting side face 30, a rear face 31, and a side face 32. An organic material layer 40 which functions as reinforcing material is made at the rear face 31 and the side face 32 of the semiconductor device 20A by vapor growth method. |
