发明名称 |
CONDUCTIVE RESIN COMPONENT, AND MOLD OF THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a conductive resin component and a molded of the same with an electromagnetic wave shielding function without using conductive fiber. SOLUTION: The conductive resin is composed of a thermoplastic resin by 5-15 weight %, a lead-free metal with low melting point by 60-70 weight % of which, a main component is tin containing nickel by 2 weight % or more, and 5 weight % or less, and copper powder by 20-30 weight %.
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申请公布号 |
JP2002124129(A) |
申请公布日期 |
2002.04.26 |
申请号 |
JP20000313211 |
申请日期 |
2000.10.13 |
申请人 |
SINTOKOGIO LTD |
发明人 |
NISHIKAWA KAZUYUKI;KATO TATSUHIKO;ASANO NORIHIRO;ZENPO TOSHIHIKO |
分类号 |
C08J5/00;C08K3/08;C08K3/10;C08L23/00;C08L101/00;H01B1/00;H01B1/22;H05K9/00;(IPC1-7):H01B1/22 |
主分类号 |
C08J5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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