| 摘要 |
<p>The object was to provide an epoxy resin composition which has excellent flame retardancy, heat resistance and humidity resistance and is advantageously used for semiconductor encapsulating, laminated boards, electrical insulation and the like. This could be reached by a thermosetting resin composition containing the following components (A) and (B): component (A): an epoxy resin, component (B): a phenol resin containing a phenol compound represented by the general formula (1) wherein R1 and R2 are a hydrogen atom or alkyl group having 1 to 4 carbon atoms, and R3 is an amino group, alkyl group having 1 to 4 carbon atoms, phenyl group, vinyl group or the like, and wherein m is an integer of 1 or 2.</p> |
