| 摘要 |
A semiconductor device 14 capable of reducing the warpage in a substrate is provided. A semiconductor chip 12 is mounted on a substrate 10 made of an electro-insulating material by flip-chip bonding, so that connector terminals formed on the substrate 10 are connected to electrodes of the semiconductor chip 12 and a gap between the substrate 10 and the semiconductor chip 12 is filled with an underfiller 18. According to the present invention, in the semiconductor device 14, none of sides of the substrate 10 is parallel to any one of sides of the semiconductor chip 12, and none of diagonal lines S of the substrate 10 coincides with any one of diagonal lines T of the semiconductor chip 12. <IMAGE> |
