发明名称 WAFER SLICE HOUSING/EXTRACTING METHOD
摘要 PROBLEM TO BE SOLVED: To prevent damage of a wafer slice during its storage/extracting to/from a carrier box for a wafer slice. SOLUTION: A elevating table 6 carrying a carrier box 1, in which slits 3 for housing a wafer slice 4 are constructed in multiple levels, and a fork 10, which can be moved in the horizontal/vertical direction so as to hold the wafer slice 4 by vacuum suction, are provided, and the fork 10 is moved forward/backward to/from the carrier box 1 while floating the wafer slice 4 in the slit 3, so that the wafer slice 4 is prevented from being scratched by the slit 3 and is not damaged.
申请公布号 JPH1067428(A) 申请公布日期 1998.03.10
申请号 JP19970114116 申请日期 1997.03.28
申请人 TEXAS INSTR JAPAN LTD 发明人 MIKAHARA TAKANORI
分类号 B65G1/00;B65G49/07;H01L21/304;H01L21/677;H01L21/68;(IPC1-7):B65G49/07 主分类号 B65G1/00
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