| 摘要 |
The chip card has an outer foil (1) acting as a circuit board substrate with structured conductor paths cooperating with the chip (6), which is mounted on the outer foil via a flip-chip technique using a conductive adhesive. The chip is enclosed by a core foil (2) with a corresponding locating aperture (9) and covered by a cover foil (3). All of the foils are made of a thermoplastics material, for bonding together upon application of pressure and heat, with the conductive adhesive hardened during the lamination process. |
