发明名称 INTEGRATED PRINTED CIRCUIT BOARD MOLDED FORM AND ITS PRODUCTION
摘要 PURPOSE:To provide a molded form in which a printed circuit board is accurately and strongly stuck to and followed by the three-dimensional faces of the resin molded form and multifunctionality of the circuit is made easy. CONSTITUTION:A prescribed circuit pattern is formed on the face of one side of a printed circuit board 1 and an adhesive layer is formed on the face of the other side. An integrated printed circuit board molded form is constituted by integrating the printed circuit board 1 with a resin molded form produced by injection molding through the adhesive layer. In the integrated printed circuit board molded body, a through-hole 3 is formed in the position wherein the printed circuit board is opposed to a resin injection gate 7 in a time for molding.
申请公布号 JPH06238708(A) 申请公布日期 1994.08.30
申请号 JP19930051232 申请日期 1993.02.18
申请人 DAINIPPON PRINTING CO LTD 发明人 YOSOMIYA TAKATOSHI;MAZAKI TADAHIRO
分类号 B29C45/14;B29C45/26;B29L31/34;H05K3/00;(IPC1-7):B29C45/14 主分类号 B29C45/14
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