发明名称 |
INTEGRATED PRINTED CIRCUIT BOARD MOLDED FORM AND ITS PRODUCTION |
摘要 |
PURPOSE:To provide a molded form in which a printed circuit board is accurately and strongly stuck to and followed by the three-dimensional faces of the resin molded form and multifunctionality of the circuit is made easy. CONSTITUTION:A prescribed circuit pattern is formed on the face of one side of a printed circuit board 1 and an adhesive layer is formed on the face of the other side. An integrated printed circuit board molded form is constituted by integrating the printed circuit board 1 with a resin molded form produced by injection molding through the adhesive layer. In the integrated printed circuit board molded body, a through-hole 3 is formed in the position wherein the printed circuit board is opposed to a resin injection gate 7 in a time for molding. |
申请公布号 |
JPH06238708(A) |
申请公布日期 |
1994.08.30 |
申请号 |
JP19930051232 |
申请日期 |
1993.02.18 |
申请人 |
DAINIPPON PRINTING CO LTD |
发明人 |
YOSOMIYA TAKATOSHI;MAZAKI TADAHIRO |
分类号 |
B29C45/14;B29C45/26;B29L31/34;H05K3/00;(IPC1-7):B29C45/14 |
主分类号 |
B29C45/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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