| 摘要 |
<p>PURPOSE: To provide a bonding method of a semiconductor chip that can prevent a short-circuiting phenomenon, generated due to the contact between a lead and the semiconductor chip. CONSTITUTION: A bonding pad 23 of a semiconductor chip 25 and a lead 29 are bonded by a bump 31, that is formed via a through-hole 27 formed at the lead 29.</p> |
