| 摘要 |
A pickup method and pickup apparatus for chip type parts (5) capable of storing a part of chip type parts (5) kept adhered with a sufficient adhesive strength on an adhesive layer (4a) formed on an expanded tape (4) for storing purpose while the other part of chip type parts (5) is adhered on the adhesive layer for current use. There is provided a pickup technique for chip type parts (5) wherein an energy beam is radiated on a part of adhesive layer fixing the chip type parts (5). |
