Method of producing semiconductor devices

摘要

Apparatus for producing semiconductor devices is provided with mold and lead frame suitable for improving the production efficiency and product quality. Also disclosed is a method of producing semiconductor devices by means of the apparatus. The mold is characterized by the shape of a die and has a plurality of pots for pressure-feeding resin, a flow passage communicating the pots with each other so as to uniformalize the molding pressure applied to the pots even if there are variations in the weights of the resin charged in the pots, and a plurality of cavities disposed in series.