| 摘要 |
<p>PURPOSE:To prevent incidence to a semiconductor chip for light reception of stray light from the periphery by forming a light-receiving window shaping a mirror surface to a recessed shape facing the optical plane of incidence of the semiconductor chip for light reception to one part of the surface of a package while forming a package surface except the light-receiving window in a satin surface. CONSTITUTION:A light-receiving window 4a shaping a mirror surface to a recessed form drawn back from the peripheral region surface of the central or]e part of the surface of the light-receiving side in a resin mold package 4 by one stage is shaped at a position facing the plane of incidence of a chip 1 to the central one part of the surface of the light-receiving side in the package 4. Other surfaces except the light- receiving window 4a are formed in satin surfaces 4b. The surface roughness of the mirror surface of the light-receiving window 4a is brought to 0.1mum or less and the surface roughness of the satin surfaces 4b to approximately 5-20mum, and stepped difference between a recessed section shaping the light-receiving window 4a and the surface of the peripheral surface of the window 4a is set to approximately 0.05-0.20mm. Accordingly, the chip 1 and a lead frame 2 are set into a cavity, and a transparent resin is injected into the cavity under the state, thus molding the resin mold package 4 into which the chip 1 and the lead frame 2 are sealed.</p> |
