发明名称 BONDER
摘要 PURPOSE:To enable each of difference models of work to be set at the optimum position without unit exchange by providing a control means which can set works at bonding positions by controlling a transfer means on the basis of work detection signals of a detection means provided in the upper stream of a bonding stage. CONSTITUTION:A work transferred onto a frame chute 18 is moved over this chute 18 in the longitudinal direction by means of a pitch roller 19 rotated by a roller drive part 43. Then, at the point when the work constructed as the multiseries lead frame is moved to the neighborhood of the first bonding position, a TV camera 13 detects the work X and stops its movement by the pitch roller 19 via central control part 52, picking up the image of the work surface, then feeding the patterns of pad positions of a semiconductor pellet, lead shapes, work outer shapes, etc. out to the central control part 52 as a signal S1. This part 52 determines the optimum position and the present position of the work X and its amount of displacement on the basis of a signal S2 for types and the like and this signal S1, then outputting the adjustment signal obtained on the basis of the results to the roller drive part 43.
申请公布号 JPS6151932(A) 申请公布日期 1986.03.14
申请号 JP19840173331 申请日期 1984.08.22
申请人 HITACHI LTD;HITACHI TOKYO ELECTRONICS CO LTD 发明人 WATANABE KENJI;YAMAZAKI ISAMU;KYOMASU RYUICHI;TAKASUGI NOBUHIRO;MIMATA TSUTOMU;SUMIYA OSAMU
分类号 H01L21/52;H01L21/50 主分类号 H01L21/52
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