| 摘要 |
The present invention relates to the encapsulation of integrated circuits. To increase the number of external connection pins or the thickness of these pins and therefore the thermal dissipation, without being limited by the technology of mechanical blanking of the connection grids intended to form these pins (which technology prevents the blanking of pins of width or gap which are less than the thickness of the grid), two grids are superimposed, the branches 32 of one being intercalated between the branches 34 of the other, with a residual space i between the adjacent branches, which is smallish and smaller than the thickness e of the grids. The superimposed grids return to a same plane during encapsulation in a plastic resin. The gold connection wires between the branches 32, 34 of the grids and the integrated circuit chip 14 preserve a minimum length. <IMAGE> |
