| 发明名称 | Semiconductor border protection sealant | ||
| 摘要 | A semiconductor package includes a semiconductor unit containing an active circuitry layer. The semiconductor package also includes a plurality of bonding pads on the active circuitry layer, which are configured to be connected to corresponding external conductive connectors. The semiconductor package also includes a protective sealant coating filling grooved edges of the active circuitry layer. The protective sealant coating contains an exterior wafer-singulated surface. | ||
| 申请公布号 | US9390993(B2) | 申请公布日期 | 2016.07.12 |
| 申请号 | US201414518947 | 申请日期 | 2014.10.20 |
| 申请人 | Broadcom Corporation | 发明人 | Zhao Sam Ziqun;Kirkpatrick Galen;Law Edward;Khan Reza;Sze Ming Wang |
| 分类号 | H01L23/31;H01L21/56;H01L21/683;H01L21/78;H01L23/00;H01L21/66;H01L23/544 | 主分类号 | H01L23/31 |
| 代理机构 | Oblon, McClelland, Maier & Neustadt, L.L.P. | 代理人 | Oblon, McClelland, Maier & Neustadt, L.L.P. |
| 主权项 | 1. A semiconductor package, comprising: a semiconductor unit containing an active circuitry layer; a plurality of solder balls connected to the active circuitry layer, and configured to be connected to corresponding external conductive connectors; and a protective sealant coating filling grooved edges of the active circuitry layer, wherein the protective sealant coating contains an exterior wafer-singulated surface; and the plurality of solder balls extend through a plane of an outer surface of the protective sealant coating. | ||
| 地址 | Irvine CA US | ||