| 摘要 |
<p>PURPOSE:To provide a conductive composition, a ceramic multilayered substrate using it and a semiconductor device using the ceramic multilayered in which appearance defects such as the warp of the substrate and cracks and also bonding failure such as separation between the board, an internal conductive layer and a via hole conductor are brought about. CONSTITUTION:This composition is an internal conductive layer 2 provided among alumina compound series low-temperature sintered substrates 1 laminated in multilayers and a conductive composition used for a via hole conductor 3 making continuity therebetween. The conductive composition is constituted of metal powder, a sinter control agent, an inorganic bonding agent and a vehicle. The foregoing metal powder contains Ag and Pd, the sinter control agent containing one or more speceis of Cr or Cr compounds and the inorganic bonding agent contains the powder of alumina compound series low-temperature sintered substrate materials.</p> |
