METHOD OF FABRICATING SEMICONDUCTOR DEVICE

摘要

PURPOSE: The method is for forming resistor lay out of a semiconductor device enabling the fabrication of large integrated semiconductor device by minimizing the area of a resistor lay out part by forming a resistor using two layers of a poly-1 and a poly-2. CONSTITUTION: The method can reduce the area a resistor occupies in the lay out considerably by lay out using two layers of a poly-1 layer(1) and a poly-2 layer(3) simultaneously, and can adjust the resistance using a contact(5) when it is needed to adjust the resistance in the revision step.