发明名称 METHOD AND DEVICE FOR INSPECTING SUBSTRATE SURFACE DEFECT
摘要 <p>PROBLEM TO BE SOLVED: To provide a method and device for inspecting a surface defect of a substrate.SOLUTION: A method for detecting surface defects such as a slip line occurring on a substrate to be applied to electronics, optoelectronics or analogue devices comprises at least the steps of: projecting a pattern 3 composed of a light fringe 4 and a dark band 5 in a stripe pattern onto a substrate, and reflecting the fringe by a surface of a substrate 2; relatively displacing the pattern 3 and the substrate along at least one direction, and displacing the fringe 4 of the pattern 3 on the substrate; acquiring at least three sequenced images of the pattern 3 reflected by the substrate in the accordance with displacement of the fringe 4 by use of a light reception sensor; measuring a gradient angle of the substrate surface, utilizing the displacement of the fringe 4 of the pattern 3; and determining presence/absence of the surface defect of the substrate by using a variation of the gradient angle of the substrate surface.</p>
申请公布号 JP2015028482(A) 申请公布日期 2015.02.12
申请号 JP20140159099 申请日期 2014.08.04
申请人 SOI TEC SILICON ON INSULATOR TECHNOLOGIES;ALTATECH SEMICONDUCTOR 发明人 CECILE MOULIN;SOPHIE MORITZ;PHILIPPE GASTALDO;FRANCOIS BERGER;JEAN-LUC DELCARI;PATRICE BELIN;MALEVILLE CHRISTOPHE
分类号 G01N21/956;G01B11/30;G01N21/88;H01L21/66 主分类号 G01N21/956
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