发明名称 |
METHOD AND DEVICE FOR INSPECTING SUBSTRATE SURFACE DEFECT |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method and device for inspecting a surface defect of a substrate.SOLUTION: A method for detecting surface defects such as a slip line occurring on a substrate to be applied to electronics, optoelectronics or analogue devices comprises at least the steps of: projecting a pattern 3 composed of a light fringe 4 and a dark band 5 in a stripe pattern onto a substrate, and reflecting the fringe by a surface of a substrate 2; relatively displacing the pattern 3 and the substrate along at least one direction, and displacing the fringe 4 of the pattern 3 on the substrate; acquiring at least three sequenced images of the pattern 3 reflected by the substrate in the accordance with displacement of the fringe 4 by use of a light reception sensor; measuring a gradient angle of the substrate surface, utilizing the displacement of the fringe 4 of the pattern 3; and determining presence/absence of the surface defect of the substrate by using a variation of the gradient angle of the substrate surface.</p> |
申请公布号 |
JP2015028482(A) |
申请公布日期 |
2015.02.12 |
申请号 |
JP20140159099 |
申请日期 |
2014.08.04 |
申请人 |
SOI TEC SILICON ON INSULATOR TECHNOLOGIES;ALTATECH SEMICONDUCTOR |
发明人 |
CECILE MOULIN;SOPHIE MORITZ;PHILIPPE GASTALDO;FRANCOIS BERGER;JEAN-LUC DELCARI;PATRICE BELIN;MALEVILLE CHRISTOPHE |
分类号 |
G01N21/956;G01B11/30;G01N21/88;H01L21/66 |
主分类号 |
G01N21/956 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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