| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an epoxy resin excellent in solvent solubility, heat resistance, and low linear expansion property, and to provide an epoxy resin composition, a laminate for an electric/electronic circuit, and a cured product.SOLUTION: There are provided: the epoxy resin which has a bisphenol structure having a specific cyclic skeleton, and a specific imide structure and has a weight-average molecular weight of 1,000-200,000; the epoxy resin composition containing the epoxy resin and a curing agent; the cured product obtained by curing the epoxy resin composition; and the laminate for an electric/electronic circuit which is formed using the epoxy resin composition.</p> |
