| 摘要 |
The present invention relates to a shield can plate for a printed circuit board and a method for manufacturing the same. The method for manufacturing the shield can plate comprises a first step (S210) for preparing a metal plate (110) by producing it; a second step (S220) for completing the manufacturing of a shield can plate (100) by carrying out screen printing for the surface of the metal plate (110) once or for more times to form 0.5μm of a shield layer (120) having an elongation percentage higher than 50% and a static frictional coefficient lower than 0.5μwhile the metal plate (110) prepared by the first step is injected into a processing position of a screen printer; and a third step (S230) for forming a plurality of pilot pin holes for continuously press-processing the shield can plate (100) on both sides of the metal plate (110) after the second step (S220). The present invention further includes a cleaning step using chemicals such as phosphates, chromates, titanium nitrite, molybdate or azole before the shield layer (120) is formed on the surface of the metal plate (110) after the first step (S210); and a processing step to continuously punch or bend the shield can plate (100) after the third step (S230), which has a plurality of the pilot pin holes to have a predetermined pattern corresponding to the shape of a printed circuit board using a press device. [Reference numerals] (S210) Step for manufacturing and preparing a metal plate; (S220) Step for forming a shield layer by a screen printer; (S230) Step for forming pilot pin holes |
