摘要 |
<p><P>PROBLEM TO BE SOLVED: To discriminate the position of an adhesive layer for die adhesion in a dicing die bond film when a semiconductor wafer and the dicing die bond film are laminated. <P>SOLUTION: The dicing die bond film 10 has a supporting base material 1, a pressure-sensitive adhesive layer 2 provided on the supporting base material 1, and an adhesive layer 3 for die adhesion provided on the pressure-sensitive adhesive layer 2, and further markings 5 to discriminate the position of the adhesive layer 3 for die adhesion. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |