发明名称 DICING DIE BOND FILM
摘要 <p><P>PROBLEM TO BE SOLVED: To discriminate the position of an adhesive layer for die adhesion in a dicing die bond film when a semiconductor wafer and the dicing die bond film are laminated. <P>SOLUTION: The dicing die bond film 10 has a supporting base material 1, a pressure-sensitive adhesive layer 2 provided on the supporting base material 1, and an adhesive layer 3 for die adhesion provided on the pressure-sensitive adhesive layer 2, and further markings 5 to discriminate the position of the adhesive layer 3 for die adhesion. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2008047926(A) 申请公布日期 2008.02.28
申请号 JP20070218750 申请日期 2007.08.24
申请人 NITTO DENKO CORP 发明人 MATSUMURA TAKESHI;YAMAMOTO MASAYUKI
分类号 H01L21/52;C09J7/02;H01L21/301;H01L21/683 主分类号 H01L21/52
代理机构 代理人
主权项
地址
您可能感兴趣的专利