发明名称 POLYIMIDE PRECURSOR COMPOSITION, AND WIRING CIRCUIT BOARD EMPLOYING THE COMPOSITION
摘要 A polyimide precursor composition comprises (A), and at least one of (B) and (C), (B) and (C) being present in a proportion of 30-100 parts by weight based on 100 parts by weight of (A): (A) a polyimide precursor comprising: (a1) a unit of formula (1): R1 is a C1-C3 alkyl group connected to an aromatic ring, m is 0 or not greater than 4, and n is 1 to 4; and (a2) a unit of formula (2): (a1) and (a2) are present in a molar ratio of 20/80 to 70/30; (B) a compound of formula (3): R2 is a hydrogen atom or a methyl group, and R3 is a divalent hydrocarbon group having two or more carbon atoms; and (C) a compound of formula (4): R4 is a hydroxyl group or a methoxy group, R5 is a hydrogen atom or a methyl group, and k is 4-23.
申请公布号 US2013118788(A1) 申请公布日期 2013.05.16
申请号 US201213609864 申请日期 2012.09.11
申请人 HISHIKI TOMOAKI;HIKITA TAKAMI;SAKAKURA TAKATOSHI;NITTO DENKO CORPORATION 发明人 HISHIKI TOMOAKI;HIKITA TAKAMI;SAKAKURA TAKATOSHI
分类号 C09D177/10;H05K1/03 主分类号 C09D177/10
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