发明名称 |
HEAT DISSIPATION DEVICE AND SEMICONDUCTOR DEVICE |
摘要 |
Disclosed is a heat dissipation device (H) which is reduced in the number of components, while having sufficient insulating function and cooling function with respect to an object to be cooled (12). The heat dissipation device (H) comprises a base (14) that is formed from a ceramic and a refrigerant channel (T) for circulating a refrigerant within the base. The base (14) is formed by sintering a stacked body in which a plurality of ceramic sheets (13a, 13b, 13c, 13d) are stacked. The plurality of ceramic sheets include the ceramic sheet (13c) which is provided with a plurality of slits (S) that constitute the refrigerant channel (T), and the ceramic sheets (13a, 13b) which are provided with communication paths (R1, R2) that communicate the refrigerant channel (T) and outside units (P1, P2) with each other. A semiconductor device (10) is configured by bonding a metal plate (11), on which a semiconductor element (12) is mounted, to the heat dissipation device (H). |
申请公布号 |
EP2565920(A1) |
申请公布日期 |
2013.03.06 |
申请号 |
EP20110775143 |
申请日期 |
2011.04.28 |
申请人 |
KABUSHIKI KAISHA TOYOTA JIDOSHOKKI;KYOCERA CORPORATION |
发明人 |
MORI, SHOGO;IWATA, YOSHITAKA;WATANABE, SATOSHI;TSUBOKAWA, KENJI;KAWAGUCHI, TOSHIO |
分类号 |
H01L23/473;H01L21/48;H01L23/373;H05K7/20 |
主分类号 |
H01L23/473 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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