发明名称 HEAT SINK
摘要 <P>PROBLEM TO BE SOLVED: To provide a heat sink which can prevent displacement between the heat sink and a substrate from occurring by making stable pressing force act on a mounted electronic component in a temporary stop operation to the substrate. <P>SOLUTION: A heat sink comprises a flat plate part 2 radiating heat from a heating part of a substrate 50. The flat plate part 2 includes: substrate locking members 10 fixed to the substrate; and press locking members 20 pressing the flat plate part to the heating part of the substrate. The substrate locking member 10 has a positioning part protruding toward the substrate side to engage with the substrate and keeping an interval between the substrate and the flat plate part. The press locking member 20 includes: a pressing part 21 composed of a plate material having elasticity, brought into surface contact and fixed to the flat plate part 2; and a connection part 22 protruding toward the outside of an edge of the flat plate part 2 from the pressing part 21, formed so as to be bent toward the substrate side and inserted and locked to a through hole formed in the substrate. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013004642(A) 申请公布日期 2013.01.07
申请号 JP20110132835 申请日期 2011.06.15
申请人 FURUKAWA ELECTRIC CO LTD:THE 发明人 MATSUO MASAHIRO;HIRASAWA MASASHI;YAMAMOTO MASAAKI
分类号 H01L23/40;H05K7/20 主分类号 H01L23/40
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