| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a laser processing device enabling the various ways of irradiating laser beams such as laser beam welding of a straight line, a circle, a ring (a doughnut shape) and the like, and uniform laser irradiation; and easily responding to failures of semiconductor laser elements or optical fibers. <P>SOLUTION: The laser processing device comprises connection connectors 6 coupled to a plurality of semiconductor laser elements 5 via optical fibers 7; a multi-fiber connector 3 to which irradiation side tip ends 4a of optical fibers 4 are coupled; the first optical fibers 4 connected to the multi-fiber connector 3; and the second optical fibers 7 connecting the connection connectors 6 and the semiconductor laser elements 5 and being attached/detached to/from the semiconductor laser elements 5. The connection connectors 6 are detachably coupled with the first optical fibers 4 and the second optical fibers 7, and connect some of the first optical fibers for switching. <P>COPYRIGHT: (C)2012,JPO&INPIT |
