| 摘要 |
PURPOSE: A DC and an RF hybrid processing system are provided to process a substrate and/or a wafer in real time by using a direct current and radio frequency hybrid process tool and a direct current / radio frequency hybrid recipe and/or a model related thereof. CONSTITUTION: In a DC and an RF hybrid processing system, a system controller(190) is connected to an MES(180) by using a first data transmission server system(181). A lithography subsystem(110) comprises a return / storage element(112), a processing element(113), and a controller(114). A return subsystem(170) is combined in the return / storage element, the processing element and/or an evaluation element(115). A substrate(105) is returned in real time through combination between the return subsystem and the lithography subsystem. An exposure subsystem(120) comprises the return / storage element(122), the processing element(123), and a controller(124). |
