发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a photosensitive resin composition suitable for forming a thick film. SOLUTION: The photosensitive resin composition comprises: a siloxane polymer (A) containing a polymerizable group and polymerizing by light irradiation; a terminal-modified siloxane compound (B); and a polymeric initiator (C). COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011054682(A) 申请公布日期 2011.03.17
申请号 JP20090200705 申请日期 2009.08.31
申请人 TOKYO OHKA KOGYO CO LTD 发明人 SHIMATANI SATOSHI;TAKAGI TOSHIYA
分类号 H01L21/027;C08F290/14 主分类号 H01L21/027
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