摘要 |
An interface structure (400) includes first(402a) and second portions(402b). The first portion has physical dimensions that are compatible with the docki ng area (356) of an associated device tester(352), and includes a first socket (304) configured to receive a first BGA package (100). The second portion, which is adjacent to and contiguous with the first portion, extends laterall y beyond the docking area of the device tester to provide additional testing area that may include one or more additional sockets(404). In one embodiment , the second portion includes a second socket (404) configured to receive a second BGA package (200), wherein the second size and configuration of secon d BGA package are different from the size and configuration of the first BGA package.
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