| 摘要 |
The invention relates to a method for producing a contact arrangement (10) between a microelectronic component (11) and a supporting substrate (12) as well as a component unit (24) produced by said method. According to the invention, thermal energy is produced in connecting areas by backward impingement of the component with laser energy, a mechanical connecting contact (23) is formed between opposing connecting surfaces (17, 18) of the component and the supporting substrate, and at least one electrically conductive connection contact (22) is formed between the connecting surfaces of the supporting substrate and the component (13, 15) by at least the partial melting of soldered material, said connecting surfaces being arranged in an angle to each other. The component produced by said method has at leat one contact arrangement. |
