发明名称 HEAT AGING-RESISTANT POLYAMIDES
摘要 Disclosed are thermoplastic molding materials containing: A) 10 to 99 percent by weight of at least one thermoplastic polyamide; B) 0.1 to 5 percent by weight of at least one polyethyleneimine homopolymer or copolymer; C) 0.05 to 3 percent by weight of a lubricant; D) 0.05 to 3 percent by weight of a copper-containing stabilizer or a sterically hindered phenol or the mixtures thereof; E) 0 to 60 percent by weight of other additives, the total percentage by weight of components (A) to (E) amounting to 100 percent.
申请公布号 KR20070102739(A) 申请公布日期 2007.10.19
申请号 KR20077020471 申请日期 2006.02.08
申请人 BASF AKTIENGESELLSCHAFT 发明人 EIBECK PETER;ENGELMANN JOCHEN;NEUHAUS RALF;FISCHER MICHAEL;BRUCHMANN BERND
分类号 C08K3/16;C08K5/098;C08K5/20;C08L79/02 主分类号 C08K3/16
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