发明名称 |
HEAT AGING-RESISTANT POLYAMIDES |
摘要 |
Disclosed are thermoplastic molding materials containing: A) 10 to 99 percent by weight of at least one thermoplastic polyamide; B) 0.1 to 5 percent by weight of at least one polyethyleneimine homopolymer or copolymer; C) 0.05 to 3 percent by weight of a lubricant; D) 0.05 to 3 percent by weight of a copper-containing stabilizer or a sterically hindered phenol or the mixtures thereof; E) 0 to 60 percent by weight of other additives, the total percentage by weight of components (A) to (E) amounting to 100 percent. |
申请公布号 |
KR20070102739(A) |
申请公布日期 |
2007.10.19 |
申请号 |
KR20077020471 |
申请日期 |
2006.02.08 |
申请人 |
BASF AKTIENGESELLSCHAFT |
发明人 |
EIBECK PETER;ENGELMANN JOCHEN;NEUHAUS RALF;FISCHER MICHAEL;BRUCHMANN BERND |
分类号 |
C08K3/16;C08K5/098;C08K5/20;C08L79/02 |
主分类号 |
C08K3/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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